我們研發(fā)并生產(chǎn)的2-6英半導(dǎo)體級以及半絕緣級高純度砷化鎵晶體和晶片被廣泛應(yīng)用于半導(dǎo)體集成電路以及LED通用照明等領(lǐng)域。
Our 2’’ to 6’’ semi-conducting & semi-insulating GaAs crystal & wafer are wildly used in semiconductor integrated circuit application & LED general lighting application.
	
半導(dǎo)體砷化鎵規(guī)格 Specifications of semi-conducting GaAs wafer
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					生長方法   | 
			
				 VGF  | 
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					  摻雜類型   | 
			
				 
					  P型:鋅    | 
			
				 
					  N型:硅   | 
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					  晶片形狀   | 
			
				 
					  圓形(尺寸2、3、4、6英寸)   | 
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					  晶向    | 
			
				 (100)±0.5°  | 
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					  * Other Orientations maybe available upon request    | 
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					Dopant   | 
			
				 
					硅	(N 型)   | 
			
				 
					鋅	(P 型)   | 
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					載流子濃度   | 
			
				 ( 0.8-4) × 1018  | 
			
				 ( 0.5-5) × 1019  | 
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					遷移率    | 
			
				 ( 1-2.5) × 103  | 
			
				 50-120  | 
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					  位錯    | 
			
				 100-5000  | 
			
				 3,000-5,000  | 
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					直徑   | 
			
				 50.8±0.3  | 
			
				 76.2±0.3  | 
			
				 100±0.3  | 
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					  厚度    | 
			
				 350±25  | 
			
				 625±25  | 
			
				 625±25  | 
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				 TTV [P/P] (μm)  | 
			
				 ≤ 4  | 
			
				 ≤ 4  | 
			
				 ≤ 4  | 
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				 TTV [P/E] (μm)  | 
			
				 ≤ 10  | 
			
				 ≤ 10  | 
			
				 ≤ 10  | 
		|
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				 WARP (μm)  | 
			
				 ≤ 10  | 
			
				 ≤ 10  | 
			
				 ≤ 10  | 
		|
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				 OF (mm)  | 
			
				 17±1  | 
			
				 22±1  | 
			
				 32.5±1  | 
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				 OF / IF (mm)  | 
			
				 7±1  | 
			
				 12±1  | 
			
				 18±1  | 
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				 Polish*  | 
			
				 
					E/E,   | 
			
				 
					E/E,   | 
			
				 
					E/E,   | 
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				 *E=Etched, P=Polished(*E=腐蝕, P=拋光)  | 
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					  **If needed by customer    | 
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半絕緣砷化鎵 Specifications of semi-insulating GaAs wafer
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				 生長方法 Growth Method  | 
			
				 VGF  | 
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| 
				 摻雜類型 Dopant  | 
			
				 SI 型:碳 SI Type: Carbon  | 
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				 晶片形狀 Wafer Shape  | 
			
				 圓形(尺寸2、3、4、6英寸) Round (DIA: 2", 3", 4", 6")  | 
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				 晶向 Surface Orientation *  | 
			
				 (100)±0.5°  | 
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				 * Other Orientations maybe available upon request 其他晶向要求可根據(jù)客戶需求加工  | 
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				 電阻率 Resistivity (Ω.cm)  | 
			
				 ≥ 1 × 107  | 
			
				 ≥ 1 × 108  | 
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				 遷移率 Mobility (cm2/V.S)  | 
			
				 ≥ 5,000  | 
			
				 ≥ 4,000  | 
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				 位錯 Etch Pitch Density (cm2)  | 
			
				 1,500-5,000  | 
			
				 1,500-5,000  | 
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| 
				 晶片直徑 Wafer Diameter (mm)  | 
			
				 50.8±0.3  | 
			
				 76.2±0.3  | 
			
				 100±0.3  | 
			
				 150±0.3  | 
		
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				 厚度 Thickness (μm)  | 
			
				 350±25  | 
			
				 625±25  | 
			
				 625±25  | 
			
				 675±25  | 
		
| 
				 TTV [P/P] (μm)  | 
			
				 ≤ 4  | 
			
				 ≤ 4  | 
			
				 ≤ 4  | 
			
				 ≤ 4  | 
		
| 
				 TTV [P/E] (μm)  | 
			
				 ≤ 10  | 
			
				 ≤ 10  | 
			
				 ≤ 10  | 
			
				 ≤ 10  | 
		
| 
				 WARP (μm)  | 
			
				 ≤ 10  | 
			
				 ≤ 10  | 
			
				 ≤ 10  | 
			
				 ≤ 15  | 
		
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				 OF (mm)  | 
			
				 17±1  | 
			
				 22±1  | 
			
				 32.5±1  | 
			
				 NOTCH  | 
		
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				 OF / IF (mm)  | 
			
				 7±1  | 
			
				 12±1  | 
			
				 18±1  | 
			
				 N/A  | 
		
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				 Polish*  | 
			
				 E/E, P/E, P/P  | 
			
				 E/E, P/E, P/P  | 
			
				 E/E, P/E, P/P  | 
			
				 E/E, P/E, P/P  | 
		
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				 *E=Etched, P=Polished (*E=腐蝕, P=拋光)  | 
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				 **If needed by customer 根據(jù)客戶需要  | 
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